Faculty Research Profile
Byungjo Kim
학력
· 2019: Ph.D., Mechanical Engineering, Seoul National University
· 2011: B.S., Mechanical Engineering, POSTECH
주요 경력
· 2024~present: Assistant Professor, UNIST
· 2019~2023: Staff Engineer, Mechatronics Research, Samsung Electronics Co. Ltd.
수상/학회/외부활동
· 2022: Samsung Best Paper Award Bronze (Samsung Electronics Co., Ltd)
· 2019: Excellent Doctoral Thesis Award (KSME)
· 2017~2019: Ph.D. Sponsorship Program (Samsung Electronics Co., Ltd)
· 2016: KSME-SEMES Open Innovation Challenge Bronze (KSME)
· 2004~2011: National Scholarship for Science and Engineering (KOSAF)
가상재료공정설계 연구실
Virtual Materials and Processes Design Laboratory
가상재료공정설계 연구실 (VDLab) 은 멀티스케일/멀티피직스 관점의 전산모사 기법을 활용하여 반도체 분야를 포함한 다양한 재료 및 공정에 대한 근원적인 이해와 나아가 설계안을 제공할 수 있는 고도화된 방법론 개발을 목적으로 합니다.
The Virtual Materials and Processes Design Laboratory (VDLab) endeavors to develop highly sophisticated methodologies for an essential understanding and innovative design of materials and processes across a broad spectrum, encompassing multiscale phenomena from quantum to continuum mechanics. By leveraging novel scale-bridging techniques, the laboratory addresses complex challenges in plasma-material interactions, which are pivotal for semiconductor processing. The VDLab is dedicated to optimizing material and process variables, employing multiphysics computational simulations to enhance the performance and yield of semiconductor manufacturing.
The Virtual Materials and Processes Design Laboratory (VDLab) endeavors to develop highly sophisticated methodologies for an essential understanding and innovative design of materials and processes across a broad spectrum, encompassing multiscale phenomena from quantum to continuum mechanics. By leveraging novel scale-bridging techniques, the laboratory addresses complex challenges in plasma-material interactions, which are pivotal for semiconductor processing. The VDLab is dedicated to optimizing material and process variables, employing multiphysics computational simulations to enhance the performance and yield of semiconductor manufacturing.
연구분야
멀티스케일 전산모사, 반도체 재료/공정, 플라즈마-재료 상호작용, 기능성 유연 재료
Multiscale simulation, Semiconductor materials and processes, Plasma-materials interaction, Functional soft materials
연구 희망분야
스케일 브릿징, 고성능컴퓨팅, 인공지능 활용 재료과학 / Advanced scale-bridging, High-power computing for simulation, Machine learning in materials science, Sustainable semiconductor processing, New material discovery for semiconductor applications
Advanced scale-bridging, High-power computing for simulation, Machine learning in materials science, Sustainable semiconductor processing, New material discovery for semiconductor applications
연구주제
멀티스케일 전산모사, 반도체 재료/공정 모델링, 플라즈마-재료 상호작용, 인공지능 활용 재료과학, 분자동역학, 나노복합재, 제일원리
Multiscale simulation, Semiconductor materials and processes, Plasma-materials interaction, Machine learning in materials science, Molecular dynamics, Nanocomposites, Density functional theory
Multiscale simulation, Semiconductor materials and processes, Plasma-materials interaction, Machine learning in materials science, Molecular dynamics, Nanocomposites, Density functional theory
국가연구개발사업 기술 분류체계
국가과학기술표준분류
EA. 기계 > EA02. 생산기반기술 > EA0207. 예측/시뮬레이션기술
논문
· Journal of Physics D: Applied Physics / Deep neural network-based reduced-order modeling of ion–surface interactions combined with molecular dynamics simulation / Byungjo Kim et al., / 2023-09
· Journal of Physics D: Applied Physics / Computational approach for plasma process optimization combined with deep learning model / Byungjo Kim et al., / 2023-08
· Surfaces and Interfaces / Combined molecular dynamics simulations and reaction kinetics study on wettability of Trimethylsilyl functionalized silicon surfaces / Byungjo Kim et al., / 2022-12
· Applied Surface Science / Atomistic insights on hydrogen plasma treatment for stabilizing High-k/Si interface / Byungjo Kim et al., / 2022-08
특허
· Upper electrode and substrate processing apparatus including the same / Byungjo Kim et al., / Published No.(US):11,545,344B2 / 2023-01
· Bonding head, die bonding apparatus including the same and method of manufacturing semiconductor package using the same / Byungjo Kim et al., Published No.(US):11,626,381B2 / 2023-04