Faculty Research Profile
Jingook Kim
학력
2006: Ph. D. Electrical Engineering, KAIST
2002: M. S. Electrical Engineering, KAIST
2000: B. S. Electrical Engineering, KAIST
주요 경력
2020~Present : Professor, UNIST
2011~2020 : Associate/Assistant Professor, UNIST
2009~2011 : Postdoc/ Research Professor, Missouri University of Science and Technology
2006~2008 : Senior Engineer, DRAM Design Team, Samsung Electronics
수상/학회/외부활동
한국전자파학회 우수연구자상, 2019
Best Paper Award, IEEE International Symposium on EMC and SI, July 2019.
Best Student Paper Award, 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Dec 2018.
Best Student Paper Award, 2017 Asia-Pacific International Symposium on EMC.
Best Student Paper Award, 2016 Asia-Pacific International Symposium on EMC.
Best Paper Award, IEEE Symposium on EMC and SI, 2015.
Best Technical Paper Award, IEEE International EMC Symposium, 2010
집적회로 및 전자기파 융합연구실
Integrated Circuit and Electromagnetic Compatibility Laboratory
시스템이 고속화, 고집적화, 고전력화 됨에 따라 집적회로와 전자기파 영역은 서로 융합되고 함께 해석해야 한다. 본 연구실에서는 반도체 회로와 전자파 두가지를 융합 연구하며, 특히, 전자파 관리를 위해, 반도체 회로, 패키지, 시스템을 설계한다.
The research approach of IC-EMC Lab. is to acquire a broader knowledge across sub-disciplines in high-speed silicon IC design and electromagnetics. These areas are getting more important and intertwined, as frequency goes up and systems are integrated. We design semiconductor ICs, packages, and systems for EMI management.
The research approach of IC-EMC Lab. is to acquire a broader knowledge across sub-disciplines in high-speed silicon IC design and electromagnetics. These areas are getting more important and intertwined, as frequency goes up and systems are integrated. We design semiconductor ICs, packages, and systems for EMI management.
연구분야
전자파적합성, 신호 무결성, 반도체 설계 (전자파 관리 회로), 반도체 패키지 설계, 인공지능 활용 (전자파 설계 관리) / EMC, Signal Integrity, IC Design for EMC, package design, AI-aided EMC design
EMC, Signal Integrity, IC Design for EMC, package design, AI-aided EMC design
연구 희망분야
전자파적합성, 신호 무결성, 반도체 설계 (전자파 관리 회로), 반도체 패키지 설계, 인공지능 활용 (전자파 설계 관리) / EMC, Signal Integrity, IC Design for EMC, package design, AI-aided EMC design
EMC, Signal Integrity, IC Design for EMC, package design, AI-aided EMC design
연구주제
집적회로 설계와 전자파 해석의 융합
전자파 적합성, 신호 무결성, 아날로그 회로설계, 반도체 패키지 설계, 전자파 관리용 반도체 설계
Convergence between Circuit and EM domains
Electromagnetic Compatibility, Signal Integrity, analog IC circuit design, package design, RF interference, EMI IC design
Convergence between Circuit and EM domains
Electromagnetic Compatibility, Signal Integrity, analog IC circuit design, package design, RF interference, EMI IC design
국가연구개발사업 기술 분류체계
국가과학기술표준분류
ED. 전기/전자 > ED05. 전기전자부품 > ED0599. 달리 분류되지 않는 전기전자부품
논문
1. Kyunghoon Lee, et al., and Jingook Kim, "Characterization and Application of Improved Oscilloscope IC for System Diagnosis of ESD and HPEM Effects", IEEE Transactions on Electromagnetic Compatibility, vol. 66, no. 6, pp. 1804-1818, Dec. 2024.
2. Byungjin Bae and Jingook Kim, "Quantitative Analysis and Prediction of EMI from Spread Spectrum of Differential Random Signaling based on IC Source Modeling", IEEE Transactions on Electromagnetic Compatibility, vol. 66, no. 5, pp. 1542 - 1555, Oct. 2024.
3. Jung Hoon Cho, et al., and Jingook Kim, "Prediction and Analysis of Radiated EMI from a Wafer-Level Package based on IC Source Modeling", IEEE Transactions on Electromagnetic Compatibility, vol. 66, no. 1, pp. 281-292, Feb 2024.
4. Sangyeong Jeong and Jingook Kim, "One-Chip Active EMI Filter with Integrated Buck Converter and Self-Malfunction Detection for CE Noise Reduction", IEEE Transactions on Power Electronics, vol. 38, no. 11, pp. 13977 - 13987, Nov 2023.
특허
1. “ISOLATED TYPE ACTIVE EMI FILTER HAVING NO ADDITIONAL ELEMENTS ON POWER LINE”, 17/087,340 registered in US, 201980029888.2 registered in China, 7141623 registered in Japan.
2. “DEVICE FOR COMPENSATING FOR VOLTAGE OR CURRENT”, 11,901,832 registered in US (2024-02-13), ZL202080035330.8 registered in China (2024-05-07), 7252376 registered in Japan (2023-03-27).
3. "ACTIVE CURRENT COMPENSATION DEVICE CAPABLE OF DETECTING MALFUNCTION", 17/474,558, 11,908,614 registered in US (2024-02-20).