Faculty Research Profile
Ju-Young Kim
학력
• 2007 : Ph.D., Materials Science and Engineering, Seoul National University, Korea
• 2001 : B.S., Materials Science and Engineering, Seoul National University, Korea
주요 경력
• 2011 - Present : UNIST, Republic of Korea / Professor, Department of Materials Science and Engineering
• 2007 - 2011 : Caltech, Pasadena, CA, USA / Postdoctoral Scholar, Department of Applied Physics & Materials Science
• 2004 : NIST, Boulder, CO, USA / Guest Researcher, Materials Reliability Division
로버스트 다기능 재료 연구실
Robust Multifunctional Materials Lab
울산과학기술원(UNIST)신소재공학과김주영교수님의Robust Multifunctional Materials Lab(R. Lab)에 오신 것을 환영합니다. R. Lab에서는 나노 역학 기반의 다기능 소재 개발에 주력하고 있습니다. 우리의 연구 관심사는 아래와 같습니다.
(1) 가혹한 환경에서 실시간 나노 역학
(2) 재료 및 구조 미세 구조를 제어하여 나노 다공성 금의 기계적 성능 향상
(3) 유연하고 신축성 있는 전자 및 에너지 소자의 기계적 신뢰성
(4) 반도체 첨단 패키징 구리-구리 직접 접합 및 하이브리드 본딩
Welcome to R. Lab led by Prof. Ju-Young Kim of School of Materials Science and Engineering at UNIST (Ulsan National Institute of Science and Technology), Republic of Korea. We focus on development of multifunctional materials based on nano-mechanics.
Our research interests are
(1) Nanomechanics of functional materials by in-situ nano-mechanical testing at harsh environments
(2) Enhancement of mechanical performance of nanoporous gold by controlling material and structural microstructures
(3) Mechanical reliability of flexible and stretchable electronic and energy devices
(4) Cu-to-Cu direct bonding and hybrid bonding in advanced semiconductor packaging.
Welcome to R. Lab led by Prof. Ju-Young Kim of School of Materials Science and Engineering at UNIST (Ulsan National Institute of Science and Technology), Republic of Korea. We focus on development of multifunctional materials based on nano-mechanics. Our research interests are
(1) Nanomechanics of functional materials by in-situ nano-mechanical testing at harsh environments,
(2) Enhancement of mechanical performance of nanoporous gold by controlling material and structural microstructures,
(3) Mechanical reliability of flexible and stretchable electronic and energy devices,
(4) Cu-to-Cu direct bonding and hybrid bonding in advanced semiconductor packaging.
연구분야
나노역학, 반도체 첨단 패키징, 신축 소자 신뢰성 / Nanomechanics, Advanced Semiconductor Packaging, Stretchable Device Reliability
Nanomechanics, Advanced Semiconductor Packaging, Stretchable Device Reliability
연구주제
• Nanomechanics
- In-situ nano-emchanical testing
- Mechanical properties at harsh environments
• Nanoporous Gold
- Low density and high surface area-to-volume
- Strong and tough nanoporous materials
• Device Reliability
- Reliability of flexible/stretchable devices
- Reliability modeling
• Encapsulation
- Encapsulation of perovskite solar cell
- Materials and processes for flexible and stretchable encapsulation
• Nanomechanics
- In-situ nano-emchanical testing
- Mechanical properties at harsh environments
• Nanoporous Gold
- Low density and high surface area-to-volume
- Strong and tough nanoporous materials
• Device Reliability
- Reliability of flexible/stretchable devices
- Reliability modeling
• Encapsulation
- Encapsulation of perovskite solar cell
- Materials and processes for flexible and stretchable encapsulation
국가연구개발사업 기술 분류체계
국가과학기술표준분류
EB. 재료 > EB01. 금속재료 > EB0101. 구조재료
논문
• NAUTRE ELECTRONICS / A biodegradable and self-deployable electronic tent electrode for brain cortex interfacing / J.-Y. Bae et al., / 2024
• NANO ENERGY / Ductile (Ag,Cu)2(S,Se,Te)-based auxetic metamaterials for sustainable thermoelectric power generation/ S.E. Yang et al., /2024
• ADVANCED MATERIALS / Solution-processed stretchable Ag2S semiconductor thin films for wearable self-powered nonvolatile memory / S. Jo et al., / 2021